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4.1.1 Lifted Conductor Repair, Epoxy Seal Method
Procedure to rebond a lifted conductor with liquid epoxy.
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Procedure to rebond a lifted conductor with film adhesive.
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4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
Procedure uses foil jumper bonded with liquid epoxy.
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
Procedure uses foil jumper bonded with film adhesive.
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4.2.3 Conductor Repair, Welding Method
Procedure to replace damaged conductor by welding.
4.2.4 Conductor Repair, Surface Wire Method
Procedure to replace damaged conductor with jumper wire.
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4.2.5 Conductor Repair, Through Board Wire Method
Procedure to replace damaged conductor with jumper wire .
4.2.6 Conductor Repair, Inner Layer Method
Advanced inner layer conductor repair.
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4.2.7 Conductor Repair, Surface Plane, Film Adhesive Methodd
Procedure used to repair damaged surface planes.
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4.3.1 Circuit Cut, Surface Circuit
Procedure to cut a surface circuit or conductor.
4.3.2 Conductor Repair, Inner Layer Method
Procedure to cut an inner layer circuit or conductor.
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4.3.3 Deleting Plated Hole Connection, Drill Through
Procedure to sever internal connection by drilling out hole.
4.3.4 Deleting Plated Hole Connection, Spoke Cut
Procedure to sever internal connection by cutting internal spokes.
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4.4.1 Lifted Land Repair, Epoxy Seal Method
Procedure to rebond a lifted land with liquid epoxy.
4.4.2 Lifted Land Repair, Film Adhesive Method
Procedure to rebond a lifted land with film adhesive.
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4.5.1 Land Repair, Epoxy Method
Procedure to replace damaged land with liquid epoxy.
4.5.2 Land Repair, Film Adhesive Method
Procedure to replace damaged land with film adhesive.
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4.6.1 Edge Contact Repair, Epoxy Method
Procedure to replace damaged edge contacts with liquid epoxy.
4.6.2 Edge Contact Repair, Film Adhesive Method
Procedure to replace damaged edge contacts with film adhesive.
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4.6.3 Edge Contact Repair, Plating Method
Procedure used to replate damaged or solder
contaminated edge contacts by brush plating.
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4.7.1 Surface Mount Pad Repair, Epoxy Method
Procedure to replace damaged SM pads with liquid epoxy.
4.7.2 Surface Mount Pad Repair, Film Adhesive Method
Procedure to replace damaged SM pads with film adhesive.
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4.7.3 Surface Mount BGA Pad Repair, Film Adhesive Method
Procedure to replace damaged surface mount
BGA pads with new dry film adhesive backed pads. |
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4.7.4 Surface Mount BGA Pad Repair, w/Integral Via
Procedure to replace damaged BGA pads with integral via.
4.7.5 Surface Mount BGA Pad Repair, w/Integral Via
Procedure to replace damaged BGA pads with integral via
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