Circuit Technology Center
 
No. 4.1.1
Lifted Conductor Repair, Epoxy Seal Method

OUTLINE
This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.

CAUTION
This method should not be used to rebond a circuit that has been stretched or damaged.
   
ACCEPTABILITY REFERENCES
IPC-A-600 Externally Observable Characteristics
IPC-A-610 Laminate Conditions
 
PROCEDURE REFERENCE
CTC 7721 1.0 Foreword
CTC 7721 2.1 Handling Electronic Assemblies
CTC 7721 2.2 Cleaning
CTC 7721 2.5 Baking and Preheating
CTC 7721 2.7 Epoxy Mixing and Handling
IPC 7721 4.1.1 Lifted Conductor Repair, Epoxy Seal

TOOLS & MATERIALS
Cleaner
Epoxy
Knife
Oven
Pick
Wipes

PROCEDURE

  1. Clean the area.


  2. Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.


    3. CAUTION
    Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.

     

  3. Clean the area.


  4. Mix the epoxy.


  5. Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1).


  6. Press the lifted circuit down into the epoxy and into contact with the base board material.


  7. Apply additional epoxy to the surface of the lifted circuit and to all sides as needed.


    8. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.

    CAUTION
    Some components may be sensitive to high temperature.

     

  8. Apply surface coating to match prior coating as required.


EVALUATION

  1. Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.


  2. Electrical tests as applicable.
 
Solutions Across the Board TM

Product Class:  R/F
Skill Level:  Intermediate
Conformance Level:  Medium
Revision:  D
Revision Date:  Jul 7, 2000
Repair Service Charge

  
Lifted Conductor


Figure 1: Apply a small amount of epoxy under the entire length of the lifted circuit.


Figure 2: Completed repair.
Tricks of the Trade
 The epoxy used with this method should have a high temperature resistance to withstand subsequent soldering operations. The epoxy needs to have a low viscosity to penetrate into the small space under the lifted conductor. See Epoxy for more information and a free sample.
 
 
Home · Services · Guidebook · Products · Training · Top

Circuit Technology Center, Inc.