Welcome to Circuit Technology Center's On-Line Guides. The information within these guides should be helpful to anyone who works with bare circuit boards and circuit board assemblies. These guides are packed with illustrations and videos and follow popular IPC standards. These guides will help you through the maze of challenges you face when working on modern, high density circuit boards. If your company complies with ISO-9000 or any demanding quality standard, you can refer to these guides as your on-line reference. Guides in sections 1 through 6 follow IPC 7721 Repair and Modification of Printed Boards and Electronic Assemblies. These procedures detail the proper step-by-step techniques, tools and materials, and cautions, needed to reliably repair and modify bare and assembled circuit boards. Guides in sections 7 and 8 follow IPC 7711 Rework of Electronic Assemblies. These procedures detail the proper step-by-step techniques, tools and materials, and cautions needed to reliably rework assembled circuit boards. Each procedure includes a "Conformance Level" indicated as high, medium or low. This Conformance Level indicates how closely the repaired or reworked product will be to the original specifications. The Conformance Level listed for each procedure should be used as a guide only. Each procedure also includes a "Skill Level" providing a gauge for the requisite experience and skill needed by the operator to obtain a reliable outcome. Skill Levels are listed as intermediate, advanced, or expert. The Skill Level recommended should be used as a guide only. Hundreds of detailed illustrations, as shown on the right, are included throughout this guidebook. Visit the Foreword for more information on this guidebook and how it can be used at your company to reduce waste. Visit these sections more specific information. 1.0 Foreword This section provides substantial background information about this guide and how it can be used at you company.   2.0 Basic Procedures This section covers handling, cleaning, coatings, legend, and use of epoxies.   3.0 Base Board Procedures This section covers repair of delamination, warp, key slots, non plated holes, surface defects, and various defects to base board material.   4.0 Conductor Procedures This section covers repair and rework of conductors including circuits, lands, gold contacts, surface mount pads, and BGA pads.   5.0 Plated Hole Procedures This section covers various methods for plated hole repair.   6.0 Jumper Wires and Component Modification Procedures This section includes excellent procedures for adding jumper wires and performing various component modifications.   7.0 Soldering Procedures This section includes procedures for soldering a variety of component types including chip components, J lead components and gull wing components.   8.0 Rework Procedures This section includes procedures for removing a variety of component types including chip components, J lead components, gull wing components and BGA components.   Solutions Across the Board TM Section 2 covers procedures for coating removal and replacement. Section 3 covers procedures for base board repair. Section 4 covers procedures for conductor repair. Section 6 covers jumper wire procedures. Section 7 and 8 cover soldering and desoldering procedures.

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