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2.1 Handling Electronic Assemblies
Procedure covers the proper methods
for handling circuit boards. |
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2.2.1 Cleaning, Local
Procedure outlines bench top hand cleaning.
2.2.2 Cleaning, Aqueous Batch Process
Procedure outlines water based batch cleaning.
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2.3.1 Coating Removal, Identification of Coating
Procedure covers techniques for identifying various
coatings and recommended coating removal methods.
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2.3.2 Coating Removal, Solvent Method
Procedure uses solvent for spot removal
of solder mask and surface coatings.
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2.3.3 Coating Removal, Peeling Method
Procedure normally used to remove RTV
silicone or other thick rubbery-like coatings. |
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2.3.4 Coating Removal, Thermal Method
Procedure uses a controlled, low temperature
heating method to remove thick coatings.
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2.3.5 Coating Removal, Grinding/Scraping Method
Procedure uses various grinding and
scraping tools to remove coatings. |
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2.3.6 Coating Removal, Micro Blasting Method
Procedure uses a micro abrasive blasting system
with fine abrasive powder to remove coatings. |
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2.4.1 Coating Replacement, Solder Mask
2.4.2 Coating Replacement, Conformal Coating
2.4.2 Coating Replacement, Solder Mask, BGA
Locations
Three methods used to replace coatings and solder mask.
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2.5 Baking and Preheating
Procedure covers baking and preheating of circuit
boards to prepare them for the subsequent operations. |
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2.6.1 Legend/Marking, Stamping Method
2.6.2 Legend/Marking, Hand Lettering Method
2.6.3 Legend/Marking, Stencil Method
Three methods used to repair or add legend and markings.
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2.7 Epoxy Mixing and Handling
Procedure covers epoxy mixing and handling
for various repair and rework requirements. |
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