Circuit Technology Center
 
No. 7.4.2
Soldering Surface Mount J Lead Components Continuous Flow Method

OUTLINE
This procedure covers the general guidelines for soldering surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

ACCEPTABILITY REFERENCES
IPC-A-610  12.0 Surface Mount Assemblies
   
PROCEDURE REFERENCE
CTC 7721 1.0 Foreword
CTC 7721 2.1 Handling Electronic Assemblies
CTC 7721 2.2 Cleaning
CTC 7721 2.5 Baking and Preheating
CTC 7711 7.1.1 Soldering Basics
CTC 7711 7.1.2 Preparation For Soldering And Component Removal
CTC 7711 7.1.3 Solder Joint Acceptability Criteria
IPC 7711 5.6.4 Multi-Lead Method

TOOLS & MATERIALS
Cleaner
Flux
Microscope
Solder
Soldering Iron with Tips
Wipes

PROCEDURE

  1. Add liquid flux to the corner pads.


  2. Place the component in position and hold it steady. The leads must be aligned with the pads. On large components this is best done by aligning the leads on opposite corners. (See Figure 1).


  3. Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed.


  4. Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.


  5. Apply solder to the continuous flow solder tip to create a convex bead of molten solder on the tip. (See Figure 2).


  6. Position the solder tip so that the solder bead contacts the vertical portion of the J leads. Slowly move the tip over the row of leads to form proper solder fillets at each joint. (See Figure 3).


  7. Repeat steps 5 and 6 for the remaining sides.


  8. Clean, if required and inspect.
  
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Product Class:  R/F/W/C
Skill Level:  Intermediate
Conformance Level:  High
Revision:  D
Revision Date: Jul 7, 2000 
Repair Service Charge

Preview a Video

  
Surface Mount J Lead Component

  
Figure 1: Place component and check alignment.

  
Figure 2: Apply solder to the continuous flow solder tip to create a convex bead of molten solder.

  
Figure 3: Slowly move the tip over the row of leads to form proper solder fillets at each joint.

  
Figure 4:
A - Dot indicates pin 1
B - Indicates pin 5
C - Indicates direction of pin count.
Tricks of the Trade
 Occasionally we use this continuous flow soldering technique using either Pace or Metcal soldering tools. However, we normally use point to point soldering techniques for soldering surface components. Although this technique can save valuable time when conditions allow, we've found that we spend more time at inspection and touchup, losing any time we may have saved.
 
 
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