OUTLINE
This procedure covers the general guidelines for soldering surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

ACCEPTABILITY REFERENCES
IPC-A-610	12.0	Surface Mount Assemblies
PROCEDURE REFERENCE
CTC 7721	1.0	Foreword
CTC 7721	2.1	Handling Electronic Assemblies
CTC 7721	2.2	Cleaning
CTC 7721	2.5	Baking and Preheating
CTC 7711	7.1.1	Soldering Basics
CTC 7711	7.1.2	Preparation For Soldering And Component Removal
CTC 7711	7.1.3	Solder Joint Acceptability Criteria
IPC 7711	5.6.2	Point-To-Point-Method

TOOLS & MATERIALS
Cleaner
Flux
Microscope
Solder
Soldering Iron with Tips
Wipes

PROCEDURE

1. Add liquid flux to the corner pads.



2. Place the component in position and hold it steady. The leads must be aligned with the pads. On large components this is best done by aligning the leads on opposite corners. (See Figure 1).



3. Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed. (See Figure 2).



4. Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.



5. After the opposite corner is soldered, solder the remaining leads.



6. Clean, if required and inspect.