FlextacTM BGA Rework Stencil Kit
If you’ve been using metal stencils for BGA rework, we have
some great news for you. Flextac BGA Rework Stencils...a creative new product that is a major
improvement over what you may
be using now. These flexible solder paste stencils are laser cut from high
quality, anti-static polymer film with a residue-free adhesive backing. Because
they are self-sticking, no tape or fixturing is needed. The adhesive seals
around each BGA pad to prevent solder paste from bleeding under the stencil
when the paste is applied. Flextac Stencils are easy to use and leave no
residue on the board surface.
Current BGA rework stencils are fabricated from metal and require fixturing or taping to
position them and hold them in place. Metal stencils warp easily, and if the circuit board has
undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like
seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also
solder paste can spill out over the sides of flat metal stencils contaminating the circuit board
surface. Metal stencils require tedious stencil cleaning.
To use metal stencils effectively, a high level of operator skill is required.
To use, the operator folds the pre-scored side tabs and then
peels off the cover film from the bottom side of the stencil. The operator holds the side tabs while
placing the Flextac Stencil in position. If it is not correctly positioned, it can simply
be removed and repositioned. The side tabs also serve as solder dams preventing overspill. No
external taping or fixturing is used. Next the operator applies
a small dab of solder paste and uses a standard squeegee to spread the paste. Since the
residue-free
adhesive seals around each BGA pad, the operator can make as many passes as necessary with the squeegee
to assure proper aperture filling. The Flextac Stencil is then peeled up leaving a perfect
deposit of solder on each pad. Although Flextac Stencils are disposable, they can be used several times.
Application
- Applying solder paste for BGA rework.
Features and Benefits
- Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed.
- Laser cut ensures precise aperture size.
- Disposable - eliminates tedious stencil cleaning.
- Flexible - conforms to board surface.
- Fold-up sides for easy placement and solder paste containment.
- Low cost.
- Packaged in a handy ESD safe carrying case
Part Number |
Description |
Price
|
201-3120 |
Flextac BGA Rework Stencil Kit |
$199.00 |
115-5999 |
Flextac Stencil New Pattern Design Fee |
595.00 |
Flextac BGA Rework Stencil Kit Includes
Freight, duties, and value added taxes may increase prices for products outside the US.
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Solutions Across the Board
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Ordering Information
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Flextac BGA Rework Stencil Kit is packaged in a rugged ESD safe case.
The Kit includes 20 different sizes of BGA rework stencils, a spatula handle and three sizes
of spatula blades.
View larger image.
Step 1: Select the proper size and fold up the side tabs.
Step 2: Peel off the cover film exposing the adhesive backing
Step 3: Place in position using the handy side tabs.
Step 4: Apply paste using a standard metal squeegee.
Step 5: Remove the stencil and save for another reuse or dispose.
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