Flextac BGA Rework Stencil
Flextac Stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use
a residue-free adhesive similar to Post-itŪ Notes. The self-sticking adhesive seals around each
BGA pad to ensure that solder paste will not bleed under the stencil when the paste is applied.
Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
If you currently use metal stencils you need to fixture them or tape them in position to hold them
in place. Metal stencils can warp, and if the circuit board has undulations in the board surface,
the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily
bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill
out over the sides of flat stencils contaminating the circuit board surface.
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Part Number: B6-292-2727-127
Pattern shown twice actual size.
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Stencil Thickness: .006" (0.152 mm)
Aperture Size: .025" (0.635 mm)
Ball Count: 292
Ball Pattern: 20 x 20 P4-Row + 6 x 6 center
Pitch: .050" (1.27 mm)
Component Body Size: 27 mm x 27 mm
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