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3.1 Delamination/Blister Repair, Injection Method
Procedure covers repair of mechanical or
thermal blisters in circuit board base materials.
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3.2 Bow and Twist Repair
Procedure is used to eliminate, or reduce
the bow and twist, or warping of circuit boards.
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3.3.1 Hole Repair, Epoxy Method
Procedure used to repair minor damage to non-plated holes.
3.3.2 Hole Repair, Transplant Method
Procedure used to repair major damage to non-plated holes.
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3.4.1 Key and Slot Repair, Epoxy Method
Procedure used to repair minor damage to key and slot openings.
3.4.2 Key and Slot, Transplant Method
Procedure used to repair major damage to key and slot openings.
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3.5.1 Base Board Repair, Epoxy Method
Procedure used to repair minor damage to base board surface.
3.5.2 Base Board, Area Transplant Method
Procedure used to repair major damage to base board areas.
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3.5.3 Base Board Repair, Edge Transplant Method
Procedure used to repair broken cornes and
edge damage using tongue and grove technique.
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