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IPC-7711/7721 Rework & Repair Instructor Course
This IPC certified five day comprehensive course provides a consistent training program based on the technical guidelines of IPC-7711, Rework of Electronic Assemblies, and IPC-7721, Repair and Modification of Printed Boards and Electronic Assemblies. This in-depth course covers the procedures in both manuals. Upon completion of the course the IPC Registered Instructor will be certified to teach, and certify operator proficiency to any of the ten IPC-7711, or IPC-7721 modules. This course is based upon the newly released IPC-7711 and IPC-7721 Standards. Certified Instructors will contribute to their Company's ability to lead both their Company and their Customers toward consistent terms of acceptability. Certified Instructors will gain the knowledge and skills needed to instruct operators in the techniques to reliably rework and restore damaged PC boards, covering in detail the most common rework problems encountered in today's highly complex manufacturing environment, using a variety of rework tools and techniques. Includes in-depth instruction on removal, site preparation, and installation of Chip, Gull Wing, and J-Lead components, using soldering irons, tweezer tools, hot air pencils with solder paste, and vacuum desoldering. In addition, the certified instructor will refine, or gain in, their knowledge and skills of PCB Damage Repair and Modification. Enabling them to instruct the operator or technician in the latest industry accepted techniques of: Splicing Wires. Modifications (Jumper Wires). Repairing physical damage found on modern PC board assemblies. Includes in-depth instruction on base board repair, conductor repair, land repair, gold edge contact repair, and surface mount pad repair . Certification Upon completing the course each instructor student receives an IPC-7711/7721 certification from Circuit Technology Center confirming that they understand the science of PCB Rework, Modification or Repair, and have demonstrated the competent skills necessary for meeting the demands of current electronic packaging. Recommended for training instructors who require a certification of their ability to instruct others in the knowledge and skills of the latest PCB rework, repair and modification techniques. |
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Covers skills to repair damage SMT pads.
Figure 1: Covers skills to repair circuitry and holes.
INSTRUCTOR COURSE OUTLINE
| Reference | Number | Description |
| MODULE 1: General Introduction, Skill Assessment | ||
| IPC-7721 | 1.0 | General Introduction |
| MODULE 2: Wire Splicing | ||
| IPC-7711 | 8.1 | General Splicing |
| IPC-7711 | 8.1.1 | Mesh Splice |
| IPC-7711 | 8.1.2 | Wrap Splice |
| IPC-7711 | 8.1.3 | Hook Splice |
| MODULE 3: Through Hole Components | ||
| IPC-7711 | 3.1.1 | Through-Hole Desoldering - Continuous Vacuum Method |
| IPC-7711 | 3.1.2 | Through-Hole Desoldering - Continuous Vacuum Method, partial clinch |
| IPC-7711 | 3.1.3 | Through-Hole Desoldering - Continuous Vacuum Method, partial clinch |
| IPC-7711 | 3.1.4 | Through-Hole Desoldering - Wicking Method, partial clinch |
| J-HBK-001 | Pg. 46 | Component Preparation |
| MODULE 4: Chip and MELF Removal & Replacement | ||
| IPC-7711 | 3.3.1 | Bifurcated tip |
| IPC-7711 | 3.3.2 | Tweezer Method |
| IPC-7711 | 3.3.3 | Bottom Termination - Hot Air Method |
| IPC-7711 | 4.1.1 | Surface Mount Land Preparation _ Individual Method |
| IPC-7711 | 4.1.2 | Surface Mount Land Preparation _ Continuous Method |
| IPC-7711 | 4.1.3 | Surface Solder Removal - Braid Method |
| IPC-7711 | 4.2.1 | Pad Releveling |
| IPC-7711 | 4.3.1 | SMT Land Tinning |
| IPC-7711 | 4.4.1 | Cleaning SMT Lands |
| IPC-7711 | 5.3.1 | Chip Installation - Solder Paste Method |
| IPC-7711 | 5.3.2 | Chip Installation - Point-to-Point Method |
| IPC-610 | 0.0.0 | Chip and MELF Mounting Acceptability/Requirements |
| MODULE 5: SOIC and SOT Procedures | ||
| IPC-7711 | 3.5.1 | SOT Removal-Flux Application Method |
| IPC-7711 | 3.5.2 | SOT Removal-Flux Application, Tweezer Method |
| IPC-7711 | 3.6.2 | Gull Wing Removal (two sided) - Solder Wrap Method |
| IPC-7711 | 3.6.6 | Gull Wing Removal (two sided) - Flux Application, Tweezer Method |
| IPC-7711 | 4.1.1 | Surface Mount Land Preparation _ Individual Method |
| IPC-7711 | 4.1.2 | Surface Mount Land Preparation _ Continuous Method |
| IPC-7711 | 4.1.3 | Surface Solder Removal - Braid Method |
| IPC-7711 | 4.2.1 | Pad Releveling |
| IPC-7711 | 4.3.1 | SMT Land Tinning |
| IPC-7711 | 5.5.1 | Gull Wing Installation - Multi-Lead Method - Top of Lead |
| IPC-7711 | 5.5.3 | Gull Wing Installation - Point-to-Point Method |
| IPC-7711 | 5.5.4 | Gull Wing Installation - Hot Air Pencil/Solder Paste Method |
| IPC-610 | 0.0.0 | SOT and SOIC Mounting Acceptability/Requirements |
| IPC-7711 | 6.1.4 | Removing Shorts Between Gull Wing, Respread Method |
| MODULE 6: Ball Grid Array Removal and Replacement (Lecture only) | ||
| IPC-7711 | 3.3.9.1 | BGA/CSP Removal |
| IPC-7711 | 3.3.9.2 | BGA Removal, Vacuum Method |
| MODULE 7: J-Lead and QFP Procedures | ||
| IPC-7711 | 3.7.1 | Gull Wing Removal (four-sided), Bridge Fill Method - Vacuum Cup |
| IPC-7711 | 3.7.4 | Gull Wing Removal (four-sided), Bridge Fill Method - Tweezer |
| IPC-7711 | 3.7.7 | Gull Wing Removal (four-sided), Hot Gas (Air) Reflow Method |
| IPC-7711 | 3.8.2 | J-Lead Removal, Solder Wrap Method - Tweezer |
| IPC-7711 | 4.1.2 | Surface Mount Land Preparation _ Continuous Method |
| IPC-7711 | 4.1.3 | Surface Solder Removal - Braid Method |
| IPC-7711 | 4.2.1 | Pad Releveling |
| IPC-7711 | 4.3.1 | SMT Land Tinning |
| IPC-7711 | 5.5.1 | Gull Wing Installation - Multi-Lead Method - Top of Lead |
| IPC-7711 | 5.5.3 | Gull Wing Installation, Point-to-Point Method |
| IPC-7711 | 5.5.4 | Gull Wing Installation - Hot Air Pencil/Solder Paste Method |
| IPC-7711 | 5.6.1 | J-Lead Installation, Wire Solder Method |
| IPC-7711 | 5.6.2 | J-Lead Installation, Point-to-Point Method |
| IPC-7711 | 5.6.3 | J-Lead Installation, Solder Paste Method/Hot Air Pencil Method |
| IPC-610 | 0.0.0 | Gull Wing and J-Lead Mounting Acceptability/Requirements |
| IPC-7711 | 6.1.1 | Removing Shorts, J-Leads - Draw off Method |
| IPC-7711 | 6.1.2 | Removing Shorts, J-Leads - Respread Method |
| MODULE 8: Coating, Identification, Removal & Replacement | ||
| IPC-7711 | 2.4.1 | Coating Removal, Identification of Conformal Coating |
| IPC-7711 | 2.4.2 | Coating Removal, Solvent Method |
| IPC-7711 | 2.4.3 | Coating Removal, Peeling Method |
| IPC-7711 | 2.4.4 | Coating Removal, Thermal Method |
| IPC-7711 | 2.4.5 | Coating Removal, Grinding/Scraping Method |
| IPC-7711 | 2.4.6 | Coating Removal, Micro Blasting Method |
| IPC-7721 | 2.4.1 | Coating Replacement, Solder Resist |
| IPC-7721 | 2.5 | Surface Preparation, Baking and Preheating |
| MODULE 9: PWB Circuit Repair | ||
| IPC-7721 | 4.2.1 | Conductor Repair, Foil Jumper - Epoxy Method |
| IPC-7721 | 4.2.2 | Conductor Repair, Film Adhesive Method |
| IPC-7721 | 4.5.2 | Land Repair, Film Adhesive Method |
| IPC-7721 | 4.1.1 | Lifted Conductor Repair, Epoxy Method |
| IPC-7721 | 5.1 | Plated Through Hole Repair, No Inner Layer Connection |
| IPC-7721 | 6.1 | Jumper Wire Installation |
| IPC-7721 | 2.6 | Epoxy Mixing and Handling |
| MODULE 10: Laminate Repair | ||
| IPC-7721 | 3.3.1 | Hole Repair, Epoxy Method |
| IPC-7721 | 3.3.2 | Hole Repair, transplant Method |
| IPC-7721 | 2.5.1 | Base Material Repair, Epoxy Method |
| IPC-7721 | 2.6 | Epoxy Mixing and Handling |
| MODULE 11: Policy and Procedures | ||
| This Module covers the Policy and Procedures expected of Instructors. |
| Course No. | Description | Price |
| 025-0050 | IPC-7711/7721 Rework and Repair Instructor Course - IPC certified | $3195.00 |
Schedule/Registration
Visit our Schedule/Registration page for schedule dates and on-line registration.
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