BGA
Rework Course
This course is designed for students who require
the hands-on skill and knowledge to reliably remove
and replace a variety of BGA components. Students are
taught a practical approach for safe BGA component
processing. The course includes a review of thermal
profiling, preheat considerations, process techniques
and a review and interpretation of x-rays results.
A brief theoretical discussion is followed by hands-on
board preparation and equipment processing time.
The two day course is limited to a maximum of four students.
If you're planning on using BGA packages in new
designs, this would be a great opportunity to get some
background on design considerations. If your area of
responsibility is the SMT line, this course will fill
you in on process considerations for BGA installation
and removal. If you have rework responsibilities you
will learn about rework machine capabilities,
remove/replace process development plus hints on the
process differences between BGA types.
Topics Include
A review of the different BGA packages - ceramic, plastic,
metal and micro.
A review of the parameters for establishing a safe
thermal profile.
Circuit board preparation - masking, baking and other
process steps.
BGA site preparation.
Solder mask breakdown - how to prevent it, how to fix
it.
Review of solder paste and stencil selection.
BGA removal and replacement process.
Inspection and interpreting x-ray results.
Equipment review - all the tools you need to do the
job.
Certification
Upon completing the course each student receives a
certification from the Circuit Technology Center
confirming that they understand the science of high
quality BGA rework, and have demonstrated the
competent skills necessary for meeting the demands of
modern electronic packaging. Certification references
include: IPC-A-610 Acceptability of Electronic
Assemblies and J-Std-001 Requirements for Soldered
Electrical and Electronic Assemblies. Recommended for
operators, technicians, training instructors, anyone
who requires a working knowledge of the latest BGA
rework techniques.
Location
This course is available at
the Circuit Technology Center training facility in Haverhill, MA.
or on-site at the customers location.
The successful application of new technologies
demands an educated workforce. Make sure you and your
employees have the education and training needed to
keep your company ahead of the pack.
| Course No. |
Description |
Price |
| 025-0035 |
Ball Grid Array - 2 Day Course at Circuit Technology Center |
$995.00 per student |
| 025-0035 |
Ball Grid Array - 2 Day Course on-site. Maximum 4 students |
$3980.00 per class |
Schedule/Registration
Visit our Schedule/Registration
page for schedule dates and on-line registration.
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Solutions Across
the Board
TM
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Students perform hands-on BGA rework using high
end systems throughout this course.
The BGA removal and replacement process is reviewed in detail.
Review and interpretation of X-ray inspection is included.
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