Surface Mount and BGA Pad Repair
Surface mount and BGA pad repair are routine operations performed daily at
Circuit Technology Center. Damaged pads are replaced with specially fabricated, adhesive backed
pads that are thermally bonded to the board surface. This reliable IPC recommended
method eliminates the need for using messy liquid epoxies to bond replacement pads in place.
We stock thousands of different sizes and shapes of replacement pads.
Refer to the Reference Procedures below for a detailed review of the step-by-step
procedures we follow to repair and rework circuit boards.
Reference Procedures - Service Charges
No. |
Description |
First Area |
Additional Areas |
4.7.2 |
Surface Mount Pad Repair, Film Adhesive Method |
$56.00 |
$13.50 Each |
4.7.3 |
Surface Mount, BGA Pad Repair, Film Adhesive Method
|
$69.50 |
$13.50 Each |
|
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Solutions Across
the Board
TM
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