| Overall Frame Size: |
2.25" x 1.50" (57 x 38 mm) |
| Pattern Size: |
0.050"/0.060" dia. (1.270 mm x 1.524 mm) |
| Recommended Bonding Tip: |
No. 115-2202 0.060" dia. (1.524 mm) |
| Base Material: |
Rolled annealed copper foil .0014" (.036 mm) thick. |
| Adhesive Backing: |
Phenolic Butral film adhesive .0018" (.046 mm) thick. |
| Bonding Temperature: |
475°F ± 25°F (246°C ± 14°C) |
| Bonding Time: |
30 seconds |
| Peel Strength: |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Shelf Life: |
6 months minimum. Each Circuit Frame is stamped with the expiration date. |
| Standard Plating: |
.001" (.0254 mm) 60/40 tin/lead minimum. |
| Standard Price: |
$33.00 each |
