CBlankA
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded PC boards -- all in about 30 seconds.
Replacement Circuit Frames with dry-film epoxy backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to the PC board surface with a bonding iron or bonding press.
Choose a standard Circuit Frame or let us design and fabricate a custom size.
Material Specifications
Frame Size: 2.25" x 1.50" (57 x 38 mm)
Base Material: Rolled annealed copper foil .0014" (.036 mm) thick
Adhesive Backing: Phenolic Butral film adhesive .0018" (.046 mm) thick
Bonding Temperature: 475°F ± 25°F (246°C ± 14°C)
Bonding Time: 30 seconds
Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material
Shelf Life: 6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Specifications
G - Tin/Lead: .001" 60/40 tin/lead minimum.
|
Tin/Lead Plated
| Part No. |
Description |
Plating |
Price |
| CBlankA |
Contacts .035" x .080" (0.89 mm x 2.03 mm) |
Tin/Lead |
$33.00 |
NOTE: International prices may be dramatically affected by
freight, duties, or value added taxes.
|
|
|
|
