Circuit Bonding Evaluation Kit
The tools and materials in this kit let you evaluate the IPC recommended process
for replacing damaged surface mount and BGA pads, lands, and edge contacts.
It’s the ideal, low-cost way to “test drive” and evaluate this money
saving repair process.
Application - This kit provides materials to evaluate the following.
Features and Benefits
- Economical - lets you evaluate IPC recommended repair process.
- Complete instructions included
Part No. |
Description |
Price |
201-1130 |
Circuit Bonding Evaluation Kit, 120 VAC |
$149.00 |
201-1132 |
Circuit Bonding Evaluation Kit, 230 VAC * |
149.00 |
Kit Includes
Part No. |
Qty |
Description |
Replacement Price |
115-3102 |
1 |
Bonding Iron, 120 VAC |
$49.00 |
115-2104 |
1 |
Bonding Tip, Tapered |
39.00 |
115-2306 |
1 |
Bonding Tip, .040" x .060" |
39.00
|
115-2318 |
1 |
Bonding Tip, .080" x .500" |
39.00
|
CFV003T |
1 |
Circuit Frame, Variety |
33.00 |
115-3302 |
1 |
Epoxy |
5.90 each |
235-2102 |
1 |
Foam Swab |
19.00 pkg/100 |
355-2102 |
1 |
Knife |
3.15 |
115-3314 |
1 |
Mixing Stick |
7.50 pkg/100 |
115-3312 |
1 |
Plastic Cup |
7.50 pkg 100 |
115-3360 |
1 |
Plastic Probe |
19.00 pkg 100 |
950-4508 |
1 |
Tape, Kapton |
3.90 |
335-5183 |
1 |
Tweezer |
7.50 |
115-3103 |
1 |
* Bonding Iron, 230 VAC (201-1132 Kit) |
49.00 |
Freight, duties, and value added taxes may increase prices for products outside the US.
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Solutions Across the Board
TM
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Ordering Information
Before
After
Includes materials to evaluate surface mount pad repair using
replacement dry film adhesive backed pads.
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