Section 8.0 Rework Procedures
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8.1.1 Comp. Removal, Through Hole Vacuum Method
Procedure covers through hole powered vacuum desoldering.
8.1.2 Comp. Removal, Through Hole, Solder Fountain Method
Procedure covers through hole removal using solder fountain. |
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8.2.1 Comp. Removal, Chip Comp., Forked Tip Method *
Forked tip method for chip component removal.
8.2.2 Comp. Removal, Chip Comp., Hot Tweezer Method *
Hot tweezer method for chip component removal. |
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8.3.1 Comp. Removal, J Lead Comp., Conduction Method *
Contact method of J lead component removal.
8.3.2 Comp. Removal, J Lead Comp., Hot Gas Method *
Convection method of J lead component removal. |
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8.4.1 Comp. Removal, Gull Wing Comp., Conduction Method *
Contact method of gull wing component removal.
8.4.2 Comp. Removal, Gull Wing Comp., Hot Gas Method *
Convection method of gull wing component removal. |
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8.5.2 Profile Development, BGA Components
Criteria for establishing profiles for BGA component removal.
8.5.3 BGA Component Rework, Hot Gas/Air Method
Hot gas method for rework of plastic BGA components. |
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* Procedures include video clips
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