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7.1.1 Soldering Basics
Procedure covers the basic concepts for quality soldering.
7.1.2 Preparation For Soldering And Component Removal
Procedure covers preparing steps before soldering and rework.
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7.1.3 Solder Joint Acceptance Criteria
Document includes figures and tables for solder
joint acceptability criteria based on IPC standards.
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7.2.1 Soldering Through Hole Components, Point To Point
Procedure covers point to point through hole soldering.
7.2.2 Soldering Through Hole Components, Solder Fountain
Procedure covers through hole fountain soldering. |
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7.3.1 Soldering Surface Mount Chip Components, Point To Point
Procedure covers point to point soldering of chip components.
7.3.2 Soldering Surface Mount Chip Components, Hot Gas *
Procedure covers hot gas soldering of chip components. |
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3 separate methods for soldering J Lead components.
7.4.1 Soldering J Lead Components, Point To Point *
7.4.2 Soldering J Lead Components, Continuous Flow *
7.4.3 Soldering J Lead Components, Hot Gas *
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3 separate methods for soldering gull wing components.
7.5.1 Soldering Gull Wing Components, Point To Point *
7.5.2 Soldering Gull Wing Components, Continuous Flow *
7.5.3 Soldering Gull Wing Components, Hot Gas *
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