Circuit Technology Center
 

No. 7.1.3
Solder Joint Acceptance Criteria

OUTLINE
This document includes figures and tables for solder joint acceptability criteria on a variety of component types.

NOTE
For the most up to date information on solder joint acceptability criteria refer to:
IPC-A-610    Acceptability of Electronic Assemblies
J-STD-001    Requirements for Soldered Electrical and Electronic Assemblies

ACCEPTABILITY REFERENCES
IPC-A-610 5.0 Component Installation
IPC-A-610 6.0 Soldering
IPC-A-610 12.0 Surface Mount Assemblies
 
PROCEDURE REFERENCE
CTC 7721 1.0 Foreword
CTC 7711 7.1.1 Soldering Basics
CTC 7711 7.1.2 Preparation For Soldering And Component Removal

 
Solutions Across the Board TM


Preview our New IPC
Soldering and Rework Skills
Certifications Kits.

Product Class:  R/F/W/C
Skill Level:  Intermediate
Conformance Level:  N/A
Revision:  D
Revision Date: July 7, 2000
Repair Service Charge


Figure 1: Dimensional Criteria for Through Hole Components

Table 1: Acceptable Solder Criteria for Through Hole Components

Feature Dim Class 1 Class 2 Class 3
Circumferential wetting on solder destination side of lead and barrel. A Not Specified 180 270
Vertical Fill of Solder2. B Not Specified 75% 75%
Circumferential fillet and wetting on solder source side. C 270 270 330
Percentage of original land area covered with wetted solder on solder destination side. D 0 0 0
Percentage of original land area covered with wetted solder - solder source side. E 75% 75% 75%

NOTES
1. Wetted solder refers to solder applied by the solder process.
2. The 25% unfilled volume includes both source and destination side depressions.


Figure 2: Dimensional Criteria for Chip Components

Table 2: Acceptable Solder Criteria for Chip Components

Feature Dim Class 1 Class 2 Class 3
Maximum Side Overhang A 1/2W or 1/2P or 1.50 mm (.060") whichever is less 1/2W or 1/2P or 1.50 mm (.060") whichever is less 1/4W or 1/4P or 1.50 mm (.060") whichever is less
Maximum End Overhang B Not Permitted Not Permitted Not Permitted
Minimum End Joint Width C 1/2W or 1/2P whichever is less 1/2W or 1/2P whichever is less 3/4W or 3/4P whichever is less
Minimum Side Joint Length D Not required Not required Not required
Maximum Fillet Height E See Note 1 See Note 1 See Note 1
Minimum Fillet Height F See Note 2 G + 1/4H or 0.50 mm (.020") whichever is less G + 1/4H or 0.50 mm (.020") whichever is less
Minimum Thickness G See Note 2 See Note 2 0.2 mm (.008") (See Note 3)
Minimum End Overlap J Required Required Required

NOTES
1. The maximum fillet may overhang the land or extend onto the top of the chip cap metallization; however the solder shall not extend further onto the component body.
2. Properly wetted fillet evident.
3. Unless satisfactory cleaning can be demonstrated with reduced clearance.


Figure 3: Dimensional Criteria for J Lead Components


Table 3: Acceptable Solder Criteria for J Lead Components

Feature Dim Class 1 Class 2 Class 3
Maximum Side Overhang A 1/2W 1/2W 1/4W
Maximum Toe Overhang B Unspecified Unspecified Unspecified
Minimum End Joint Width C See Note 2 W - A W - A
Minimum Side Joint Length D See Note 2 1 1/2 W 1 1/2 W
Maximum Fillet Height E See Note 1 See Note 1 See Note 1
Minimum Heel Fillet Height F See Note 2 G + 1/2 T G + T
Minimum Thickness G See Note 2 See Note 2 See Note 2

NOTES
1. The maximum solder fillet shall not touch package body. 2. Properly wetted fillet evident.


Figure 4: Dimensional Criteria for Gull Wing Components

Table 4: Acceptable Solder Criteria for Gull Wing Components

Feature Dim Class 1 Class 2 Class 3
Maximum Side Overhang A 1/2W or 0.50 mm (.020") whichever is less 1/2W or 0.50 mm (.020") whichever is less 1/4W or 0.50 mm (.020") whichever is less
Maximum Toe Overhang B Note 2 Note 2 Note 2
Minimum End Joint Width C 1/2 W W - A W - A
Minimum Side Joint Length D W or 0.50 mm (.020") whichever is less W W
Maximum Heel Fillet Height E See Note 3 See Note 1 See Note 1
Minimum Heel Fillet Height F See Note 3 G + 1/2 T G + T
Minimum Thickness G See Note 3 See Note 3 See Note 3

NOTES
1. Solder fillet may extend through the top bend. Solder must not touch the package body or end seal, except for low profile SMD devices, e.g., SOICs, SOTs. Solder should not extend under the body of low profile surface mount components whose leads are made of Alloy 42 or similar metals.
2. Must not violate minimum design conductor spacing.
3. Properly wetted fillet evident.
 
 
Home  Services  Guidebook  Products  Training  Top

Circuit Technology Center, Inc.
45 Research Drive, Haverhill, MA 01832
Phone: 978-374-5000 Fax: 978-372-5700

Send Comments To: info@circuittechctr.com
2000 Circuit Technology Center. All rights reserved.
Хостинг от uCoz