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Surface Mount, BGA, and Through Hole Component Rework.
Removal and replacement of surface mount and through hole components is one of the most common rework processes performed on assembled circuit boards. Although commonplace and sometimes routine, today’s component packages and board features present an array of difficult component rework challenges. We have over 100 pieces of equipment from Pace, Metcal and OK Industries, Air-Vac, and Electrovert to meet the needs for all types of surface mount, BGA and through hole component rework. Our trained and qualified technicians in Massachusetts and California are ready to tackle your toughest rework projects. Surface Mount Component Rework We use a mix of convection and conduction techniques for surface mount component removal. Many factors are considered but normally conduction methods are used to remove smaller components. Convection techniques are commonly used to remove larger, more sensitive components. Point to point soldering methods are normally used to replace surface mount components. Through Hole Component Rework We use vacuum desoldering systems for small through hole removal projects. We call upon our Electrovert solder fountain systems for demanding multi-lead rework projects. These systems take great skill and experience to operate, but for high pin count through hole component rework, these workhorses can’t be beat for reliability and efficiency. Refer to the Reference Procedures below for a detailed review of the step-by-step procedures we follow to repair and rework circuit boards. Reference Procedures - Service Charges
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Delicate operations require surgeon-like skills.
Controlled hot air rework.
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