Circuit Technology Center
 
Circuit Bonding Evaluation  Kit

The tools and materials in this kit let you evaluate the IPC recommended process for replacing damaged surface mount and BGA pads, lands, and edge contacts. It’s the ideal, low-cost way to “test drive” and evaluate this money saving repair process.

Application - This kit provides materials to evaluate the following. Features and Benefits
  • Economical - lets you evaluate IPC recommended repair process.
  • Complete instructions included
Part No. Description Price
201-1130 Circuit Bonding Evaluation Kit, 120 VAC $149.00
201-1132 Circuit Bonding Evaluation Kit, 230 VAC * 149.00


Kit Includes
Part No. Qty Description Replacement Price
115-3102 1 Bonding Iron, 120 VAC $49.00
115-2104 1 Bonding Tip, Tapered 39.00
115-2306 1 Bonding Tip, .040" x .060" 39.00
115-2318 1 Bonding Tip, .080" x .500" 39.00
CFV003T 1 Circuit Frame, Variety 33.00
115-3302 1 Epoxy 5.90 each
235-2102 1 Foam Swab 19.00 pkg/100
355-2102 1 Knife 3.15
115-3314 1 Mixing Stick 7.50 pkg/100
115-3312 1 Plastic Cup 7.50 pkg 100
115-3360 1 Plastic Probe 19.00 pkg 100
950-4508 1 Tape, Kapton 3.90
335-5183 1 Tweezer 7.50
115-3103 1 * Bonding Iron, 230 VAC (201-1132 Kit) 49.00
Freight, duties, and value added taxes may increase prices for products outside the US.
 
Solutions Across the Board TM

Ordering Information


Before                          After
Includes materials to evaluate surface mount pad repair using replacement dry film adhesive backed pads.
 
 
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