html>

Section 5.0 Plated Hole Procedures 5.1 Plated Hole Repair, No Inner Layer Connection Procedure covers the repair of a damaged hole that has no inner layer connection. 5.2 Plated Hole Repair, Double Wall Method Procedure covers use of an eyelet for the repair of a damaged pad on a hole with an inner layer connect. 5.3 Plated Hole Repair, Inner Layer Connection Procedure uses an eyelet to repair a plated through hole that has an inner layer connect.

Home · Services · Guidebook · Products · Training · Top Circuit Technology Center, Inc.