Circuit Technology Center
 
No. 2.3.2
Coating Removal, Solvent Method

OUTLINE
This procedure uses a solvent to remove surface coatings. This procedure can be use for spot or overall coating removal of conformal coatings or solder resists.

Approved solvents may be used to remove specific soluble type coatings on a spot basis by brushing or swabbing the local area with the controlled application of solvent until the area is free of the coating material.

If warranted, all the soluble type coating can be removed by immersing and brushing the entire printed board or printed board assembly.

To determine the appropriate coating removal procedure the coating must first be identified. Refer to procedure number 2.3.1.

NOTE
Coating removal may require the use of one or more methods.

CAUTION
Determine, on a module by module basis, the hazards to parts, etc., by short term immersion in the removal solvents. If chloride based or other harsh solvents are used, extreme care must be exercised to prevent damage to base material, component parts, plated-through holes, and solder joints. Some solvent coating removal methods can cause expansion or swelling of the base material which can degrade the printed board or printed board assembly. Under no circumstances should these solvents be used except in a closely controlled process. It is recommended that the printed board or printed board assembly be inspected to ensure that no damage has occurred.

Before using any solvent refer to Material Safety Data Sheets

ACCEPTABILITY REFERENCES
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Laminate Conditions
 
PROCEDURE REFERENCE
CTC 7721 1.0 Foreword
CTC 7721 2.1 Handling Electronic Assemblies
CTC 7721 2.2 Cleaning
CTC 7721 2.3.1 Coating Removal, Identification Of Coatings
CTC 7721 2.4.1 Coating Replacement, Solder Mask
CTC 7721 2.4.2 Coating Replacement, Conformal Coatings/Encapsulants
IPC 7721 2.3.2 Coating Removal, Solvent Method

TOOLS & MATERIALS
Brushes
Coating Remover Solvent
Foam Swabs
Knife
Tape, Kapton
Thermal Parting Tool
Wood Sticks

PROCEDURE - LOCAL SPOT REMOVAL

  1. Apply Kapton tape to outline the area where the coating needs to be removed. (See Figure 1).


  2. Dip the end of a foam swab in stripping solution and apply a small amount to the coating to be removed. (See Figure 2)
  3.  

    NOTE
    Since various substances may be used as coatings, the time required for a given coating to dissolve or soften will vary. Reapply solvent several times as most solvents evaporate rapidly.

  4. Rub the treated surface carefully with a brush or wood stick to dislodge the coating. A wedge shaped applicator tip, knife, or heated blade may be effective in removing some coatings, particularly polyurethanes.


  5. Neutralize or clean the stripped area and dry.

PROCEDURE - OVERALL REMOVAL

  1. A single step for removal of all the coating may be completed by providing a continuous flow of solvent
  2. Alternately, process the board in a series of tanks containing mild solvent, starting with a high contamination tank and progressing sequentially to a final, fresh solvent tank.

EVALUATION

  1. Visual examination or UV light may be used to verify complete removal of coating.

 

 
Solutions Across the Board TM

Product Class:  R/F/W/C
Skill Level:  Advanced
Conformance Level:  High
Revision:  E
Revision Date:  Jul 7, 2000
Repair Service Charge

  
Coating Removal Required At Outlined Area

  
Figure 1: Apply Kapton tape to outline area for coating removal


  
Figure 2: Apply solvent with a foam swab to remove coating.


  
Figure 3: Removal complete.
  

Tricks of the Trade
We rarely use this procedure. Most of the solvents used to remove coatings from circuit board surfaces will attach to circuit board base material. However, when circumstances allow, this method can be efficient and effective. We will normally first attempt to use 2.3.5 Coating Removal, Grinding/Scraping Method or 2.3.6 Coating Removal, Micro Blasting Method.
 
 
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