|
|
|
Leading the Way in BGA Services Circuit Technology Center has solutions to all of your BGA rework and repair applications. Our facilities are equipped with state of the art equipment; a staff of engineers and operators possessing the knowledge and skills needed in the intricate world of BGA technology. We offer a wide variety of services including BGA component removal, replacement and salvage; x-ray inspection services; circuit pattern design changes at BGA sites; sealing or isolating adjacent vias with solder mask; repairing lifted or missing BGA pads; and repair of solder mask at the BGA site. We also offer training and technical support to provide you with one stop shopping to for all of your BGA repair and rework needs. BGA Pad and Solder Mask Repair Damaged to BGA pads and solder mask is repaired by highly skilled operators following IPC documented procedures. Damaged or missing pads are replaced with specially fabricated adhesive backed pads that are thermally bonded to the board surface. Solder mask damage is corrected with high strength, high temperature epoxy sealing the surface while maintaining a low profile. BGA Site Modification When design changes at BGA sites occur we can make the change by adding new circuit patterns to the board surface. The new patterns is bonded to the board and encapsulated with high strength epoxy. Whether it’s rerouting a signal or isolating a BGA pad, our expert operators routinely accomplish the task. BGA Component Removal and Replacement We have several-sophisticated BGA rework systems and a fully trained staff of engineers and operators to support you. This combination provides you with a repeatable process completed to the highest quality level. We’re recognized as an industry leader in BGA services and have been qualified by companies across the US. If you have one board or one thousand boards for rework, we’re the company to turn to for BGA rework services. X-ray Inspection X-ray services for BGA component and site inspection is completed on every board we process to ensure the highest quality level. The Nicolet, NXR-1410I X-ray system is ideal for inspection of BGA components and offers a wide selection of flexibility features for detecting soldering defects such as shorts, opens and voids. Refer to the Reference Procedures below for a detailed review of the step-by-step procedures we follow to repair and rework circuit boards. Reference Procedures - Service Charges
* X-ray inspection included in price. ** Minimum 2 sites. Review requirements for development boards and components needed for BGA rework profiling. |
|
Four BGA rework systems and a team of expert operators work at Circuit Technology Center.
BGA rework is a challenge, but routine for the experts at Circuit Technology Center.
|
|
|
|
| |