Circuit Technology Center
 
Circuit Frame Number: CC070080AG

Circuit Frame shown twice actual size.


Specifications
Overall Frame Size: 2.25" x 1.50" (57 x 38 mm)
Pattern Size: 0.070"/0.080" x 0.750" (1.778 mm/2.032 mm x 19.050 mm)
Recommended Bonding Tip: No. 115-2318 .080" x .500" (2.032 mm x 12.700 mm)
Base Material: Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing: Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature: 475°F ± 25°F (246°C ± 14°C)
Bonding Time: 30 seconds
Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life: 6 months minimum. Each Circuit Frame is stamped with the expiration date.
Standard Plating: .000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.
Standard Price: $49.00 each

Freight, duties, and value added taxes may increase prices for products outside the US.
 
 
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Circuit Technology Center, Inc.