Circuit Technology Center
 
Circuit Frame Number: CC038255AG

Circuit Frame shown twice actual size.


Specifications
Overall Frame Size: 2.25" x 1.50" (57 x 38 mm)
Pattern Size: 0.038" x 0.255" (0.965 mm x 6.477 mm)
Recommended Bonding Tip: No. 115-2314 .060" x .500" (1.524 mm x 12.700 mm)
Base Material: Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing: Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature: 475°F ± 25°F (246°C ± 14°C)
Bonding Time: 30 seconds
Peel Strength: Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life: 6 months minimum. Each Circuit Frame is stamped with the expiration date.
Standard Plating: .000050" (.00127 mm) gold over .000100" (.00254 mm) nickel minimum.
Standard Price: $49.00 each

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Circuit Technology Center, Inc.