Circuit Bonding System
Repair technicians appreciate the accuracy of this
calibrated Bonding Press, especially when repairing surface mount and BGA pads.
The press not only gives the operator better control over the bonding process,
but also ensures optimal adhesion and repeatability. The Rework Stand has a
built-in calibration slide to maintain a regulated bonding force depending upon
the circuit pattern size and shape. A digital temperature controller maintains a
uniform temperature throughout the 30-second bonding cycle.
Applications
Features and Benefits
- Precision design - permits bonding of minute patterns
- Heavy duty construction - ensures platform stability
- Built-in calibration slide maintains regulated bonding force
- Temperature controller maintains uniform bonding temperature for better results
Specifications
| Frame Construction |
11 gauge steel |
| Throat Depth |
12" (30.0 cm) |
| Throat Height |
7" (17 cm) |
| Vertical Travel |
7" (17 cm) |
| Weight |
10 lb. (4.5 kg.) |
| Power Input |
85 to 265 VDC/VAC
50 to 400 Hz 5 VA max. |
| Temperature Controller |
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| Range |
Ambient to 990°F (871°C |
| Resolution |
1°F (1°C) |
| Cycle Time |
2 to 80 sec. |
| Power Consumption |
5 VA max. |
| Heat Output |
20 Watts |
| Heat Up Time |
10 minutes |
| Part No. |
Description |
Price |
| 115-3118 |
Circuit Bonding System w/Temperature Controller, 120 VAC |
$1595.00 |
| 115-3119 |
Circuit Bonding System w/Fixed Temperature, 120 VAC |
850.00 |
| 115-3218 |
Circuit Bonding System w/Temperature Controller, 230 VAC |
1595.00 |
| 115-3219 |
Circuit Bonding System w/Fixed Temperature, 230 VAC |
850.00 |
Freight, duties, and value added taxes may increase prices for products outside the US.
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Solutions Across the Board
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Ordering Information
The Circuit Bonding System is ideal for replacing small surface mount and BGA pads.
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